View BD3376EFV-C_9020652.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

product structure : silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays . 1/1 tsz02201-0e3e0hz00740-1-2 ? 2017 rohm co., ltd. all rights reserved. 25.apr.2017 rev.002 tsz22111 ? 14 ? 001 www.rohm.com multiple input switch monitor lsi for automotive BD3376EFV-C general description BD3376EFV-C is a 10-channel multiple input switch monitor ic that detects the opening and closing of mechanical switches. once it senses a change in the status of a switch, it sends an interrupt signal to the mcu via a serial peripheral interface (spi). the 10 switch inputs have two types of power supply, vpub and vpua. the vpub and the vpua power supplies can either be from a battery or from another power supply system. vpub is the supply for the inb inputs while vpua is for the inz and ina inputs. BD3376EFV-C has two modes of operation, normal and sleep. in both modes, the internal registers can be set to make the device perform either intermittent or continuous monitoring of the switches. in intermittent monitoring, the switch status is monitored at regular time intervals, allowing the ic to operate with low power consumption. also, operation with reduced noise can be achieved by enabling uniform sequential monitoring of all switches or sequential monitoring by power supply system. application ? engine control module key specifications ? fully operational voltage range: 8v to 26v ? input voltage on switch pin : -14v to +40v ? selectable wetting current (min): 1ma, 3ma, 5ma, 10ma, 15ma ? low ?voltage operating range: 3.9v to 8.0v specifications ? aec-q100 qualified (note 1) ? uses 3.3/5.0v spi protocol in communicating with the mcu ? serial communication error checking through 8bit-crc ? thermal shutdown protection (tsd) ? power on reset (por) ? selectable source/sink current levels through register settings ? wetting current timer capability ? 4 source or sink input terminals ? 6 source input terminals ? separable power supply vpua: 7ch (ina&inz), vpub: 3ch (inb) ? interrupt notifi cation upon switch status change ? 1 to 10 times matched lpf that eliminates input terminal noise ? low current consumption (intermittent monitoring) ? status display of selected terminal at dmux terminal (note 1) grade 1 package w(typ) x d(typ) x h(max) htssop-b30 10.00mm x 7.60mm x 1.00mm typical application circuit figure 1. typical application circuit inz0 ina0 vpub sclk si wakeb vpua gnd intb so csb BD3376EFV-C +b watchdog reset mcu sclk cs so intb vin vpua/vpub vpua/vpub inz3 ina2 inb0 inb2 vpua/+b' vpua +b' io dmux vddi ref5 lvdd avdd vout1 vout2 dcdc vin si enable test datashee t
datasheet d a t a s h e e t 2/2 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 pin configuration figure 2. pin configuration (top view)
datasheet d a t a s h e e t 3/3 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 pin description table 1. pin description pin no. pin name function description equivalent circuit diagram (note 2) 1 si input spi control data input pin from the mcu (with an internal pull-down resistor) a 2 sclk input spi control clock input pin from the mcu (with an internal pull-down resistor) a 3 csb input spi control chip select input pin from the mcu (with an internal pull-up current source) b 4 dmux output digital multiplexe r for switch input output pin g 5 test input test mode control pin (n o t e 3) (with an internal pull-down resistor) j 6 lvdd input power supply input pin for the logic block (n o t e 4 ) -- 7 ref5 output 5v power supply output pin (n o t e 4) i 8 avdd input power supply input pin for the analog block (n o t e 4) -- 9 n.c. - no connection -- 10 gnd ground ground -- 11 n.c. - no connection -- 12 vpub input power supply input pin for the main system and inb switches -- 13 inb0 input switch input pin 0 under vpub power supply system (with an internal pull-up current source) f 14 inb1 input switch input pin 1 under vpub power supply system (with an internal pull-up current source) f 15 inb2 input switch input pin 2 under vpub power supply system (with an internal pull-up current source) f 16 ina0 input switch input pin 0 under vpua power supply system (with an internal pull-up current source) f 17 ina1 input switch input pin 1 under vpua power supply system (with an internal pull-up current source) f 18 ina2 input switch input pin 2 under vpua power supply system (with an internal pull-up current source) f 19 vpua input power supply input pin for ina and inz switches -- 20 n.c. - no connection -- 21 inz0 input switch input pin 0 under vpua power supply system (with an internal pull-up/down current source) e 22 inz1 input switch input pin 1 under vpua power supply system (with an internal pull-up/down current source) e 23 inz2 input switch input pin 2 under vpua power supply system (with an internal pull-up/down current source) e 24 inz3 input switch input pin 3 under vpua power supply system (with an internal pull-up/down current source) e 25 n.c. - no connection -- 26 wakeb output open-drain output pi n to monitor the mode of operation (n o t e 5) d 27 gnd ground ground pin -- 28 intb output open-drain interrupt output pin to the mcu (with an internal pull-up resistor) c 29 vddi input power supply pin for csb, si, sclk, so, intb and dmux -- 30 so output spi data output pin to the mcu h (note 2) ref. page 65 i/o equivalence circuit (note 3) short test pin to ground when mounted. (note 4) short ref5 pin to avdd pin and lvdd pin, and connect a 4.7f(min) capacitor between it and ground. do not use it as voltage source to another ic. (note 5) in the application circuit, wakeb should be pulled-up by an external resistor.
datasheet d a t a s h e e t 4/4 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 block diagram figure 3. block diagram
datasheet d a t a s h e e t 5/5 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 absolute maximum ratings table 2. absolute maximum ratings parameter symbol ratings unit supply voltage range on pin vddi, avdd, lvdd input voltage range on pin csb, si, sclk, test output voltage range at pin so, intb, dmux, ref5 - -0.3 to +7.0 v supply voltage range on pin vpua, vpub voltage range on pin wakeb - -0.3 to +40 v input current at pin wakeb - 10 ma input voltage on switch pin (inb0 to inb2, ina0 to ina2, inz0 to inz3) - -14 to +40 v storage temperature range tstg -55 to +150 c maximum junction temperature tj -40 to +150 c caution: operating the ic over the absolute maximum ratings may damage t he ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is import ant to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings.
datasheet d a t a s h e e t 6/6 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 thermal resistance (note 6) table 3. thermal resistance parameter symbol thermal resistance (typ) unit 1s (note 8) 2s2p (note 9) htssop-b30 junction to ambient
datasheet d a t a s h e e t 7/7 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 electrical characteristics spec conditions: 8.0v
datasheet d a t a s h e e t 8/8 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 electrical characteristics - continued table 8. electrical characteristics (switch input) parameter symbol min typ max unit source current 1 (internal pull-up current source) 0v external supply, vpua/vpub system (1ma setting) i source1 1.0 1.4 1.8 ma sink current 1 (internal pull-down current source) 8v external supply, vpua system (1ma setting) i sink1 1.0 1.4 1.8 ma source current 2 (internal pull-up current source) 0v external supply, vpua/vpub system (3ma setting) i source3 3.0 4.2 5.4 ma sink current 2 (internal pull-down current source) 8v external supply, vpua system (3ma setting) i sink3 3.0 4.2 5.4 ma source current 3 (internal pull-up current source) 0v external supply, vpua/vpub system (5ma setting) i source5 5.0 7.0 9.0 ma sink current 3 (internal pull-down current source) 8v external supply, vpua system (5ma setting) i sink5 5.0 7.0 9.0 ma source current 4 (internal pull-up current source) 0v external supply, vpua/vpub system (10ma setting) i source10 10.0 14.0 18.0 ma sink current 4 (internal pull-down current source) 8v external supply, vpua system (10ma setting) i sink10 10.0 14.0 18.0 ma source current 5 (internal pull-up current source) 0v external supply, vpua/vpub system (15ma setting) i source15 15.0 21.0 27.0 ma sink current 5 (internal pull-down current source) 8v external supply, vpua system (15ma setting) i sink15 15.0 21.0 27.0 ma low to high switch detection threshold voltage (3.0v setting) v th3(high) 2.7 3.0 3.3 v high to low switch detection threshold voltage (3.0v setting) v th3(low) 2.6 2.9 3.2 v low to high switch detection threshold voltage (4.0v setting) v th4(high) 3.7 4.0 4.3 v high to low switch detection threshold voltage (4.0v setting) v th4(low) 3.6 3.9 4.2 v
datasheet d a t a s h e e t 9/9 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 electrical characteristics - continued table 9. electrical characteristics (static electrical characteristics) parameter symbol min typ max unit serial interface threshold voltage (n o t e 15 ) v inlogic 0.8 - 2.2 v csb input current csb=vddi i csb(high) -10 - +10 a csb pull-up current csb=0v i csb(low) 30 40 85 a si, sclk pull-down resistor r si , r sclk 50 100 150 k ?
datasheet d a t a s h e e t 10/10 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 electrical characteristics - continued table 10. electrical characteristics (d ynamic electrical characteristics) parameter symbol min typ max unit wetting current timer counting starts after n-times detection of matched lpf t wct 13 - 22 ms interrupt delay time 1 time from switch status ch ange to intb output change in continuous monitoring t intb_dly1 - - 1 ms interrupt delay time 2 time from switch status ch ange to intb output change in intermittent monitoring n: setting time of lpf matched n-times t intb_dly2 - - [monitor cycle] x n+1 ms interrupt clear time time from csb rising edge to intb output change t intb_clr - - 150 s command set time time from csb rising edge to setting of register t reg_en - - 150 s transition time to normal mode time from csb rising edge to wakeb output change t wakeb_dly1 - - 1 ms transition time to sleep mode time from csb rising edge to wakeb output change t wakeb_dly2 - - 1 ms switch strobe time (93.75s setting) (n o t e 1 6 ) t scan _ 94 84.375 93.750 103.125 s switch strobe time (125s setting) (n o t e 1 6 ) t scan _ 125 112.5 125.0 137.5 s switch strobe time (187.5s setting) (n o t e 1 6 ) t scan _ 188 168.75 187.50 206.25 s switch strobe time (250s setting) (n o t e 1 6 ) t scan _ 250 225 250 275 s source/sink current rise time fsq=?0?, fsqz/a/b=?0?, 10ma setting load resistance 100 ? ?
datasheet d a t a s h e e t 11/11 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 electrical characteristics - continued table 11. electrical characteristics (digital interface characteristics) parameter symbol min typ max unit sclk frequency f sclk - - 4.4 mhz setup time from csb fall to sclk rise t lead 100 - 1000 ns setup time from sclk fall to csb rise t lag 50 - 500 ns setup time from si to sclk fall t si ( su ) 16 - - ns hold time from sclk fall to si t si ( hold ) 20 - - ns si, csb, sclk rise time t r ( si ) - 5.0 (n o t e 1 8 ) - ns si, csb, sclk fall time t f ( si ) - 5.0 (n o t e 1 8 ) - ns time from csb fall to so output low impedance t so ( en ) - - 55 ns time from csb rising to so output high impedance t so ( dis ) - - 55 ns sclk ?h? level width t sclkh 75 - - ns sclk ?l? level width t sclkl 75 - - ns time from sclk rise to stable so data output so c l =20pf t valid - 25 55 ns csb ?h? level time t csbh 150 - - s (note 18) reference value. timing chart serial access timing figure 4. serial access timing
datasheet d a t a s h e e t 12/12 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 timing chart - continued power supply rising/falling sequence figure 5. power supply rising/falling sequence source/sink current rise and fall time figure 6. intermittent monitoring enabled (fsq=0, fsqz/a/b =0, cmb/a/z=1), source/sink current rise and fall time t intb_clr t reg_en t intb_dly1 l 0ma l csb internal reference current source intb current source activation command i sink/source vd d i 0v 0v v por(high) por clear vpu b avdd/lvdd (supplied ref5) por v por(low) 8v ref5 null co mma nd t intb_clr t reg_en switch-on switch-off external switch undefined output current off output current on inb, ina, inz current t sr _ r internal signal scan point 20% 20 % 80% 80 % i sink/source t sr _ f external signal strobe time t scan _ 94,125,188,250 waveform
datasheet d a t a s h e e t 13/13 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 basic operations [basic operation 1] detection of switch status change (continuous monitoring) upon detection of a change in sw itch status, interrupt (intb=?h? ?l?) occurs and the ic requests serial communication with the mcu. < example of recommended operation sequence > figure 7. basic operation 1 (1) after power is turned on, interrupt (intb=?l?) occurs. (2) by serial communication, the switch status is obtained by the mcu at csb falling edge. (3) since the current source is off, the switch terminal is ?hi-z?, and the output of so is undefined. (4) internal reference current source is activated. (5) switch status is output by so. (6) interrupt is cleared (intb=?l? indefinite norma l ? mode switch ? status ? output switch ? status ? output switch ? status ? output null ? command null ? command null ? command
datasheet d a t a s h e e t 14/14 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 basic operations - continued [basic operation 2] detection of switch status change (intermittent monitoring) when intermittent monitoring is enabled, switch status is monito red by periodically turning the current source on and off. intermittent monitoring allows low power consumption. < example of recommended operation sequence > figure 8. basic operation 2 (1) after power is turned on, interrupt (intb=?l?) occurs. (2) by serial communication, the switch status is obtained by the mcu at csb falling edge. (3) since the current source is off, the switch terminal is ?hi-z?, and the output of so is undefined. (4) interrupt is cleared (intb=?l?
datasheet d a t a s h e e t 15/15 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 basic operations - continued [basic operation 3] sleep mode operation (manual transition) when mdc register of monitor mode transition comm and is set to ?1?, mode is changed to sleep. when mdc register of monitor mode transition command is set to ?0?, mode is changed to normal. during sleep mode, wakeb is in ?hi-z? state and its vo ltage level is the level of the external pull-up. < example of recommended operation sequence > figure 9. basic operation 3 (1) monitor mode transition command (sleep mode setting) is received from mcu. (2) transition to sleep mode. (3) switch change occurs (off
datasheet d a t a s h e e t 16/16 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 basic operations - continued [basic operation 4] sleep mode operation (automatic transition to normal mode) automatic transition from sleep mode to normal mode when a sw itch status changes is possi ble when the automatic mode transition setting is enabled. during sleep mode, wakeb is in ?hi-z? state and its vo ltage level is the level of the external pull-up. < example of recommended operation sequence > figure 10. basic operation 4 (1) automatic transition of mode is enable. (2) monitor mode transition command (sleep mode setting) is received from mcu. (3) transition to sleep mode. (4) switch change occurs (off
datasheet d a t a s h e e t 17/17 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 description of functions 1. power on reset (por) upon the application of an external voltage to vpub, ref5 output is generated by the ldo inside the ic. when ref5
datasheet d a t a s h e e t 18/18 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 description of functions - continued the register value output command (table 35 rier to rmdr) is used to read-back the register value written by register write command (table 35 ier to mdr). figure 11 describes the single read-back sequence. figure 12 describes the continuous sequential read-back sequence. figure 11. single read-back sequence (1) send the register value output command. the switch status is output by so. (2) read the register value by sending the null command. the result of the register value output command (1) is output by so. figure 12. continuous sequential read-back sequence (1) send the register value output command. the switch status is output by so. (2) send the register value output command following (1). (the address of the register value output command does not need to be the next address.) (3) send the register value output command repeatedly as needed. the so output at each command is the result of the previous register value output command. (4) send the null command in the end. the register value of the previous re gister output command is output by so. 3. switch status output switch status can be sent through so output.
datasheet d a t a s h e e t 19/19 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 description of functions - continued 4. interrupt (intb operation) there are five interrupt factors that cause the intb terminal to output ?l?. the type of interrupt factor that occurred can be checked in the so output when csb is ?l?. intb output will return to ?h? once the in terrupt factor is cleared by the rising edge of csb. the intb terminal is an open-drain output that is internally pulled-up to vddi. interrupt factors the interrupt factors are shown below: interrupt factor interrupt flag (so output) flag name (1) test detection so output bit [36] : ?test_flg? (2) thermal shutdown detecti on so output bit [35] : ?them_flg? (3) reset detection so output bit [34] : ?rst_flg? (4) communication error detection so output bit [33] : ?err_flg? (crc error, 40-bit frame error, or transmission and reception discrimination error) (5) switch status change dete ction so output bit [32] : ?sw_flg? (1) test detection the ic generates an interrupt after a transition to test m ode. the test terminal should always be connected to ground. (2) thermal shutdown detection interrupt occurs when the thermal shutdown circuit detec ts a temperature higher than the allowable junction temperature inside ic. (3) reset detection interrupt occurs after the activation of power on rese t (por) or the transmission of the reset command. upon por activation, the so output interrupt flag ?rst_flg? is reflected instantly. with reset command transmission, ?rst_flg? is reflected on the next command transmission. (4) communication error detection interrupt occurs due to either a crc error, a 40-bit fram e error, or a command transmission error. the interrupt flag ?err_flg? is triggered by the following : crc error : when there is a cyclic redundancy check error 40-bit frame error : when the command received is not 40-bit transmit and receive determination error : when the first two bits of the co mmand received is not [39:38]=?01? (5) switch status change detection interrupt occurs when switch a status changes (switch-on
datasheet d a t a s h e e t 20/20 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 description of functions - continued 5. operating modes BD3376EFV-C has two types of operating mode, the normal and the sleep mode. transition between the two modes can be done by sending the correct ?monitor mode transition command? . the current mode of operation can be checked through the wakeb and the so terminal outputs. monitor mode transition register address (0x4f): bit [31]: 0=normal mode, 1=sleep mode normal mode normal mode operation can be set to continuous monitoring, wher ein the switch status is checked by a continuously on current source, or to intermittent monitoring, wherein the swit ch status is checked by a regularly on/off current source. the period of intermittent monitoring (note 19) can be set according to power supply system while strobe time (note 20) is common for all switch terminals. at normal mode, wakeb is ?l? and the 30-bit of the so output is ?0?. sleep mode sleep mode operation, like in normal mode, can be set to continuous monitoring or intermittent monitoring. the monitoring period (note 19) of intermittent monitoring can be set according to power supply system. the strobe time (note 20) is common for all switch terminals and both modes. the difference with normal mode is that, from sleep mode, it is possible to change to normal mode automatically when interrupt occurs. (automatic mode transition function) at sleep mode, wakeb is in ?hi-z? state and its voltage level is the level of the exte rnal pull-up. the 30-bit of so output is ?1? at sleep mode. (note 19) monitor period is descripted in figure.13. (note 20) strobe time is descripted in figure.13. figure 13. intermittent monitoring 6. automatic mode transition function by sending the ?automatic mode transition command? through setti ng the mir register (0x4e) to ?1?, automatic transition from sleep to normal mode is possible. the conditions for a change in mode from sleep to normal to occur for both enabled and disabled ?automatic mode transition function? are shown below: conditions for sleep to normal mode transition when ?automatic mode transition function? is enabled: 1. normal mode transition command is sent 2. por occurs or reset command sent (initialization) 3. a switch status changes (the ?switch ch ange interrupt setting? should be enabled) conditions for sleep to normal mode transition when ?automatic mode transition function? is disabled: 1. normal mode transition command is sent 2. por occurs or reset command sent (initialization) monitor period strobe time current time current source on current source off current source on current source off
datasheet d a t a s h e e t 21/21 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 description of functions - continued [extension function1: intermittent monitoring at the same time (with current slope)] in intermittent monitoring, it is possible to detect the status of the all switches at the same time. when all inputs are set t o detect the switch status by intermittent monitoring , the wetting current has a rising and falling slope. normal mode setting register (0x4b) : 31 bit to 28 bit is ?0000? and intermittent monitoring setting sleep mode setting register (0x4c) : 31 bit to 28 bit is ?0000? and intermittent monitoring setting figure 14. intermittent monitoring at the same time example [extension function 2: sequential monitoring by power supply system] in this type of sequential monitoring, the status of the switches within a power s upply system is monitored one at a time. this type has no slope. since no two or more current sources in a power supply system are on at the same time, radiation noise is reduced. figure 15. sequential monitoring by power supply system example on off 5ms 10ms 2.5ms internal reference current source inz0 to inz 3 ina0 to ina 2 inb0 to inb 2 2.5ms strobe time[
datasheet d a t a s h e e t 22/22 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 description of functions - continued [extension function 3: sequential monitoring of all switch terminals] in this type of sequential monitoring, the status of all switches is monitored one at a time. since no two or more current sources are on at the same time, radiation noise is reduced. this type has no slope. the monitoring period for all switches increases by four time s the monitoring period set for the inz channels as shown in figure 16. uniform sequential monitoring and sequential monitori ng by power supply should not be enabled at the same time. in case the two sequential monitoring methods are activated si multaneously, the method which prevails is uniform sequential monitoring. figure 16. sequential monitoring of all switch terminals example fitz setting x 4 internal reference current source inz0 inz1 inz2 inz3 strobe time x 8[
datasheet d a t a s h e e t 23/23 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 description of functions - continued 7. wakeb terminal wakeb is an open drain output pin. in normal mode, its output is ?l?. in sleep mode, its output is ?hi-z? and its voltage level is the level of the external pull- up. 8. source/sink current source for switch terminal there are three types of switch terminal inputs with internal current source: inz, ina, and inb. the current level can be set for each switch terminal. current source of inz system (inz0 to inz3) this current source is used to source or sink current to the external switch. the wetting current can be interchanged between pull-up and pull-down. vpua is the powe r supply for the pull-up current source. current source of ina system (ina0 to ina2) this current source is used to source current to the external switch. vpua is the power supply current source of inb system (inb0 to inb2) this current source is used to source current to the external switch. vpub is the power supply. the current source settings can be fixed by inz current s ource/sink selection command, the current source setting command, and the holding current/wetting current value setting command.
datasheet d a t a s h e e t 24/24 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 description of functions - continued 9. wetting current timer the wetting current timer is 13ms to 22ms. this function can be enabled individually for each switch terminal. the timer starts after the switch has been detected as on. after the 13ms to 22ms timer is finished, the wetting current (10ma/15ma) is switched to holding current (1 ma/3ma/5ma). the timer is reset a fter the switch is turned off. [function operation1] wetting current timer (continuous operation) figure 17. wetting current timer (continuous operation) (1) switch change occurs (off
datasheet d a t a s h e e t 25/25 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 description of functions - continued [function operation2] wetting current timer (intermittent monitoring) figure 18. wetting current timer (intermittent monitoring) (1) switch change occurs (off
datasheet d a t a s h e e t 26/26 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 description of functions - continued 10. n-times matched filter all switch inputs have built-in ?1 to 10 times matched filters?. this function can filter the on/off switch status judgment made by the internal comparator. the filt er function can be enabled for each power supply system. if the register has been updated during the counting of the f ilter, the counting is not reset. if the monitoring method is continuous moni toring, the switch state is filtered n-times (n: 1 to 10) multiplied by the period o f the internal oscillator (32 khz). if the monitoring method is intermittent monitoring, the switch st ate is filtered n-times (n: 1 to 10) multiplied by the monito ring period. time from monitoring to end of filtering: {monitoring period x (filter number of times -1) + period of internal oscillator} to {monitoring period x (filter number of times) + period of internal oscillator} figure 19. 3 times matched filter o peration on continuous monitoring time from monitoring to end of filtering: {monitoring period x (filter number of times -1) + period of internal oscillator} to {monitoring period x (filter number of times) + period of internal oscillator} figure 20. 3 times matched filter operation on intermittent monitoring ? ?
datasheet d a t a s h e e t 27/27 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 description of functions - continued 11. digital multiplexer output (dmux) the status of the selected sw itch input is reflected by the dmux terminal. dmux takes the output of the comparator on a timing determined by the monitoring method. only one switch terminal at a time can be selected to be reflected by dmux. when no switch is selected, the output of dmux is ?l?. 12. input threshold volt age of switch terminal the switch input threshold voltage is a fraction of the avdd (note 22) voltage. it can be set to 3.0v or to 4.0v. 3.0v setting: v th3(high) =avddx0.6 ( 8.0v 1
datasheet d a t a s h e e t 28/28 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 command description each command has two types of functions. one is to write a val ue to a register. the other is to read back the register value which was written by the write command. the function to be us ed is set by the 37-bit of each command. (the null and reset commands don?t include the register value output co mmand because they don?t write in the registers.) in the command descriptions below, the write command is for wr iting a value to a register and the read command is for reading back a register value. 1. null command this command is a read only command that allows t he user to monitor interruption and switch status. table 16. null command 2. interrupt notification of switch change setting command this command allows the user to configure interrupt sources for the intb pin. specifically, this command allows the user to individually co nfigure which switches trigger an interrupt on intb by enabling or disabling the iebn, iean, and iezn setting bits shown below. the so output will return the switch status depending on the settings st ored at the next csb falling edge. table 17. interrupt notification of switch change setting command iebn (n: 2 to 0) [default: 1] in terrupt notification of switch status change for inb system 0: disabled 1: enabled iean (n: 2 to 0) [default: 1] interrupt notification of switch status change for ina system 0: disabled 1: enabled iezn (n: 3 to 0) [default: 1] interrupt notification of switch status change for inz system 0: disabled 1: enabled w/r register write/read setting 0: write 1: read 3. comparator operat ion control command this command allows the user to individually enable or di sable the switch terminal comparator for each switch input. when a switch input?s comparator is disabled through this regist er, both the corresponding settings available for that switch input within the ?interrupt notification of switch cha nge setting command? and the ?source/sink current setting command? are invalid. when the comparator is active, the switch status output does not depend on whether the wetting current is set to source or sink. the switch status output is ?1? when the sw itch is on and ?0? when the switch is off. when the comparator is set to disabl ed, the switch status is undefined. table 18. comparator oper ation control command cmbn (n: 2 to 0) [default: 1] comp arator operation for inb system 0: disabled 1: enabled cman (n: 2 to 0) [default: 1] comparator operation for ina system 0: disabled 1: enabled cmzn (n: 3 to 0) [default: 1] comp arator operation for inz system 0: disabled 1: enabled w/r register write/read setting 0: write 1: read xx crc xxxxxx 8 7 to 0 xxxxxxxx 14 13 12 11 10 9 crc 23 22 21 20 19 18 17 16 15 xxxxx setting data 000xxx 26 25 24 null command (read only) irc 0 1 0 0 0 32 31 30 29 28 27 command 0:?l?, 1:?h?, x: don't care register address setting data 39 38 37 36 35 34 33 iez2 iez1 iez0 crc iea0xxxxiez3 9 8 7 to 0 xxxxxiea2iea1 15 14 13 12 11 10 setting data crc 23 22 21 20 19 18 17 16 x x x ieb2 ieb1 ieb0 0001xx interrupt notification of sw itch change setting ier 0 1 w/r 0 29 28 27 26 25 24 35 34 33 32 31 30 command 0:?l?, 1:?h?, x: don't care register address setting data 39 38 37 36 cmz3 cmz2 cmz1 cmz0 crc cma1 cma0 x x x x xxxxxcma2 12 11 10 9 8 7 to 0 18 17 16 15 14 13 cmb2 cmb1 cmb0 setting data crc 23 22 21 20 19 0xxxxx 24 comparator operation control cmr 0 1 w/r 0 0 0 1 30 29 28 27 26 25 36 35 34 33 32 31 command 0:?l?, 1:?h?, x: don't care register address setting data 39 38 37
datasheet d a t a s h e e t 29/29 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 command description - continued 4. comparator threshold selection command this command allows the user to set the comparator threshold of the switch terminals. switch detection threshold selection is available for each power supply system (see ctb, cta and ctz settings shown below). table 19. comparator threshold selection command ctb [default: 0] comparator threshold for inb system 0: 3.0v 1: 4.0v cta [default: 0] comparator threshold for ina system 0: 3.0v 1: 4.0v ctz [default: 0] comparator threshold for inz system 0: 3.0v 1: 4.0v w/r register write/read setting 0: write 1: read 5. inz current source/sink selection command this command allows the user to select the current configurat ion, whether source (internal pull-up current source) or sink (internal pull-down current source), th rough the inz input switch terminals. table 20. inz current source/sink selection command pudn (n: 3 to 0) [default: 0] source or sink selection for inz system 0: source (internal pull-up current source) 1: sink (internal pull-down current source) w/r register write/read setting 0: write 1: read 6. current source activation command this command allows the user to enable or disable the wetting current sources at the switch input terminals. the current sources can be set to on or off per power supply system. the output current level is determined by the ?holding cu rrent / wetting current value setting command? discussed in section 7 . if an external current source is used, the comparator shoul d be enabled (see section 3 ) and the internal current source should be disabled using this register. table 21. current source activation command ceb [default: 0] current sources of inb system 0: off 1: on cea [default: 0] current sources of ina system 0: off 1: on cez [default: 0] current source of inz system 0: off 1: on w/r register write/read setting 0: write 1: read xxxxx crc xxxxxx 11 10 9 8 7 to 0 xxxxx 17 16 15 14 13 12 23 22 21 20 19 18 xxxx setting data crc 1 1 ctb cta ctz x 25 24 comparator threshold selection ctr 0 1 w/r 0 0 0 31 30 29 28 27 26 37 36 35 34 33 32 command 0:?l?, 1:?h?, x: don't care register address setting data 39 38 pud1 pud0 crc xxxxpud3pud2 8 7 to 0 xxxxxxxx 14 13 12 11 10 9 crc 23 22 21 20 19 18 17 16 15 xxxxx setting data 100xxx 26 25 24 inz current source/sink selection pudr 0 1 w/r 0 0 32 31 30 29 28 27 command 0:?l?, 1:?h?, x: don't care register address setting data 39 38 37 36 35 34 33 xxx crc xxxxxx 9 8 7 to 0 xxxxxxx 15 14 13 12 11 10 setting data crc 23 22 21 20 19 18 17 16 cezxxxxx 0101cebcea current source activation cer 0 1 w/r 0 29 28 27 26 25 24 35 34 33 32 31 30 command 0:?l?, 1:?h?, x: don't care register address setting data 39 38 37 36
datasheet d a t a s h e e t 30/30 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 command description - continued 7. holding current / wetting current level selection command this command allows the user to select the output level of each current source. this command also has arguments to set both the holding and the wetting current. the holding current can be set to 1ma, 3ma, or 5ma. the wetting current can be set to off (?hi-z?), 1ma, 3m a, 5ma (set to holding current), 10ma, or 15ma. unlike holding current, wetting current output levels can be set individually for each switch terminal. table 22. holding current / wetting current level selection command (lsb) table 23. holding current / wetting current level selection command (msb) crh [1:0] [default: 00] holding current value 00: 1ma 01: 3ma 10: 5ma 11: 1ma {mcbn (n: 2 to 0), lcbn (n: 2 to 0)} [default: 01] wetting current value for inb system 00: invalid(hi-z) 01: 1ma/3ma/ 5ma(holding current value) 10: 10ma 11: 15ma {mcan (n: 2 to 0), lcan (n: 2 to 0)} [default: 01] wetting current value for ina system 00: invalid(hi-z) 01: 1ma/3ma/ 5ma(holding current value) 10: 10ma 11: 15ma {mczn (n: 3 to 0), lczn (n: 3 to 0)} [default: 01] wetting current value for inz system 00: invalid(hi-z) 01: 1ma/3ma/ 5ma(holding current value) 10: 10ma 11: 15ma w/r register write/read setting 0: write 1: read 8. wetting current operation control command this command allows the user to enable or disable the ?wetting current timer?. this ?wetting current timer? counts 13ms to 22ms after t he switch has been closed and the wetting current changes to holding current (1ma/3ma/5ma). the timer is reset when the switch is turned off. if the wetting current level is the same as the hol ding current level, the timer does not operate. the wetting current timer can be enabled or disabled individually for each switch terminal. table 24. wetting current operation control command wtbn (n: 2 to 0) [default: 0] wetti ng current timer for inb system 0: disabled 1: enabled wtan (n: 2 to 0) [default: 0] we tting current timer for ina system 0: disabled 1: enabled wtzn (n: 3 to 0) [default: 0] we tting current timer for inz system 0: disabled 1: enabled w/r register write/read setting 0: write 1: read lcz3 lcz2 lcz1 lcz0 crc lca1 lca0 x x x x xxxxxlca2 12 11 10 9 8 7 to 0 18 17 16 15 14 13 lcb2 lcb1 lcb0 setting data crc 23 22 21 20 19 0 crh1 crh0 xxx 24 holding current / wetting current level selection (lsb) lcr01w/r0011 30 29 28 27 26 25 36 35 34 33 32 31 command 0:?l?, 1:?h?, x: don't care register address setting data 39 38 37 x mcz3 mcz2 mcz1 mcz0 crc mc a2 mc a1 mc a0 x x x 11 10 9 8 7 to 0 xxxxx 17 16 15 14 13 12 23 22 21 20 19 18 x mcb2 mcb1 mcb0 setting data crc 11xxxx 25 24 holding current / wetting current level selection (m sb) mcr01w/r001 31 30 29 28 27 26 37 36 35 34 33 32 command 0:?l?, 1:?h?, x: don't care register address setting data 39 38 wtz1 wtz0 crc xxxxwtz3wtz2 8 7 to 0 xxxxxwta2wta1wta0 14 13 12 11 10 9 crc 23 22 21 20 19 18 17 16 15 x x wtb2 wtb1 wtb0 setting data 000xxx 26 25 24 wetting current operation control wtr 0 1 w/r 0 1 32 31 30 29 28 27 command 0:?l?, 1:?h?, x: don't care register address setting data 39 38 37 36 35 34 33
datasheet d a t a s h e e t 31/31 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 command description - continued 9. n-times matched filter activation control command this command allows the user to enable or disable the n-times matched lpf. if this function is enabled, the switch out put is updated only after the comparator output has been sampled n-times (where n = 1 to 10) and if all sampled comparator outputs match. this command allows for each switch terminal to be enabled or disabled individually. table 25. n-times matched filter activation control command dfb [3:0] [default: 0000] n-times ma tched lpf settings for inb system 0000 : disabled (1 time) 0001 : 2 times 0010 : 3 times 0011 : 4 times 0100 : 5 times 0101 : 6 times 0110 : disabled (1 time) 0111 : disabled (1 time) 1000 : disabled (1 time) 1001 : 7 times 1010 : 8 times 1011 : 9 times 1100 : 10 times 1101 : disabled (1 time) 1110 : disabled (1 time) 1111 : disabled (1 time) dfa [3:0] [default: 0000] n-times matc hed lpf settings for ina system 0000 : disabled (1 time) 0001 : 2 times 0010 : 3 times 0011 : 4 times 0100 : 5 times 0101 : 6 times 0110 : disabled (1 time) 0111 : disabled (1 time) 1000 : disabled (1 time) 1001 : 7 times 1010 : 8 times 1011 : 9 times 1100 : 10 times 1101 : disabled (1 time) 1110 : disabled (1 time) 1111 : disabled (1 time) dfz [3:0] [default: 0000] n-times ma tched lpf settings for inz system 0000 : disabled (1 time) 0001 : 2 times 0010 : 3 times 0011 : 4 times 0100 : 5 times 0101 : 6 times 0110 : disabled (1 time) 0111 : disabled (1 time) 1000 : disabled (1 time) 1001 : 7 times 1010 : 8 times 1011 : 9 times 1100 : 10 times 1101 : disabled (1 time) 1110 : disabled (1 time) 1111 : disabled (1 time) w/r register write/read setting 0: write 1: read xxx crc xxxxxx 9 8 7 to 0 dfz0 dfb3 dfa3 dfz3 x x x 15 14 13 12 11 10 6hwwlqjgdwd crc 23 22 21 20 19 18 17 16 dfb0 dfa2 dfa1 dfa0 dfz2 dfz1 1001dfb2dfb1 n-times matched filter activation control dfr 0 1 w/r 0 29 28 27 26 25 24 35 34 33 32 31 30 command 0:?l?, 1:?h?, x: don't care register address setting data 39 38 37 36
datasheet d a t a s h e e t 32/32 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 command description - continued 10. dmux setting command this command allows the user to enable/disable and conf igure selected switch output on the dmux terminal. the result of the chosen switch terminal?s comparator is taken and output to dmux using timing that depends on the monitoring method used. any switch input terminal can be connected to this dmux pin by adjusting the dmx0 to dmx4 bits shown below. table 26. dmux setting command table 27. dmux channel selection 31 bit to 27 bit selected channel 00000 disabled (output is ?l?) 00001 inz0 00010 inz1 00011 inz2 00100 inz3 00101 disabled (output is ?l?) 00110 disabled (output is ?l?) 00111 disabled (output is ?l?) 01000 disabled (output is ?l?) 01001 ina0 01010 ina1 01011 ina2 01100 disabled (output is ?l?) 01101 disabled (output is ?l?) 01110 disabled (output is ?l?) 01111 disabled (output is ?l?) 10000 disabled (output is ?l?) 10001 inb0 10010 inb1 10011 inb2 10100 disabled (output is ?l?) 10101 disabled (output is ?l?) 10110 disabled (output is ?l?) 10111 to 11111 disabled (output is ?l?) dmx [4:0] [default: 00000] dmux terminal setting 00000 : disabled (dmux output is ?l?) 00001 to 00100 : inz selected channel 00101 to 01000 : disabled (dmux output is ?l?) 01001 to 01011 : ina selected channel 01100 to 10000 : disabled (dmux output is ?l?) 10001 to 10011 : inb selected channel 10100 to 11111 : disabled (dmux output is ?l?) w/r register write/read setting 0: write 1: read xxxx crc xxxxxx xxxxxx 12 11 10 9 8 7 to 0 18 17 16 15 14 13 xxx 6hwwlqjgdwd crc 23 22 21 20 19 0 d mx4 d mx3 d mx2 d mx1 d mx0 24 dmux setting dmr01w/r0101 30 29 28 27 26 25 36 35 34 33 32 31 command 0:?l?, 1:?h?, x: don't care register address setting data 39 38 37
datasheet d a t a s h e e t 33/33 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 command description - continued 11. normal mode setting command this command allows the user to set the monitoring per iod, strobe time, and monitoring method of normal mode. the normal mode is set after power on reset or by ?monitor mode transition command?. the monitoring period can be set individually per power supply system but the strobe time is common to all switch terminals. the monitoring method can be set continuous monitoring, intermi ttent monitoring at the same time, sequential monitoring by power supply system and sequential monitoring of all switch terminals. the strobe time is limited as follows. when normal mode is set at 1ms monitoring period, and sequent ial monitoring is by power supply system, only 93.75s strobe time is allowed. other st robe time settings are prohibited. when normal mode is set at 1ms monitoring period, and sequent ial monitoring is for all switch terminals, only 93.75s strobe time is allowed. other strobe time settings are prohibited. continuous monitoring: ic monitors switch status continuously. refer to the ?[basic operation 1] dete ction of switch status change (contin uous monitoring)? section for additional details. intermittent monitoring at the same time: ic monitors switch status per power supply system at the same time. refer to the ?[extension function1: in termittent monitoring at the same time (with current slope)]? section for additional details. sequential monitoring by power supply system: ic monitors switch status per switch by turns on power supply system. refer to the ?[extension function 2: sequential monitoring by power supply system]? section for additional details. sequential monitoring of all switch terminals: ic monitors switch status per switch by turns. refer to the ?[extension function 3: sequential monitoring of all switch terminals]? section for additional details. if both sequential and continuous monitoring are enabled at the same time, continuous monitoring will be the one implemented. if both sequential monitoring by power supply system and sequent ial monitoring of all switch terminals are enabled at the same time, sequential monitoring of all switch terminals will be the one implemented. table 28. normal mode setting command fsq [default: 0] sequential monitoring of all switch terminals 0: disabled 1: enabled fsqb [default: 0] sequential monitoring by power supply system for inb system 0: disabled 1: enabled fsqa [default: 0] sequential monitoring by power supply system for ina system 0: disabled 1: enabled fsqz [default: 0] sequential monitoring by power supply system for inz system 0: disabled 1: enabled fit*[3:0] (*: b, a, z) [default: 0000] monitoring period for normal mode 0000: continuous monitoring 0001: 2.5ms 0010: 5ms 0011: 10ms 0100: 20ms 0101: 30ms 0110: 40ms 0111: 50ms 1000: 100ms 1001: 1ms 1010 to 1111: setting prohibited svw [1:0] [default: 01] strobe time 00: 93.75s 01: 125s 10: 187.5s 11: 250s w/r register write/read setting 0: write 1: read xxxxx crc svw1 svw0 fitb3 fita3 fitz3 x 11 10 9 8 7 to 0 fita1 fita0 fitz2 fitz1 fitz0 17 16 15 14 13 12 23 22 21 20 19 18 fitb2 fitb1 fitb0 fita2 setting data crc 1 1 fsq fsqb fsqa fsqz 25 24 normal mode setting fmr01w/r010 31 30 29 28 27 26 37 36 35 34 33 32 command 0:?l?, 1:?h?, x: don't care register address setting data 39 38
datasheet d a t a s h e e t 34/34 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 command description - continued 12. sleep mode setting command this command allows the user to set the monitoring period and monitoring method of sleep mode. the sleep mode is set by ?monitor mode transition command?. the strobe time of sleep mode is the same as the normal mode. about the monitoring period and monitoring method, refer to the ?normal mode setting command? discussed in section 11. the strobe time is limited as follows. when normal mode is set at 1ms monitoring period, and sequent ial monitoring is by power supply system, only 93.75s strobe time is allowed. other st robe time settings are prohibited. when normal mode is set at 1ms monitoring period, and sequent ial monitoring is for all switch terminals, only 93.75s strobe time is allowed. other st robe time settings are prohibited. table 29. sleep mode setting command ssq [default: 0] sequential monitoring of all switch terminals 0: disabled 1: enabled ssqb [default: 0] sequential monitoring by power supply system for inb system 0: disabled 1: enabled ssqa [default: 0] sequential monitoring by power supply system for ina system 0: disabled 1: enabled ssqz [default: 0] sequential monitoring by power supply system for inz system 0: disabled 1: enabled sit*[3:0] (*: b, a, z) [default: 0 111] monitoring period for sleep mode 0000: continuous monitoring 0001: 2.5ms 0010: 5ms 0011: 10ms 0100: 20ms 0101: 30ms 0110: 40ms 0111: 50ms 1000: 100ms 1001: 1ms 1010 to 1111: setting prohibited w/r register write/read setting 0: write 1: read x x crc sita3sitz3xxxx 8 7 to 0 sita1 sita0 sitz2 sitz1 sitz0 x x sitb3 14 13 12 11 10 9 crc 23 22 21 20 19 18 17 16 15 ssqz sitb2 sitb1 sitb0 sita2 setting data 1 0 0 ssq ssqb ssqa 26 25 24 sleep mode setting smr 0 1 w/r 0 1 32 31 30 29 28 27 command 0:?l?, 1:?h?, x: don't care register address setting data 39 38 37 36 35 34 33
datasheet d a t a s h e e t 35/35 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 command description ? continued 13. detection edge selection command this command allows the user to configure inte rrupt trigger of switches for the intb pin. the interrupt trigger can be set to only the falling edge (note 23) or both the rising and falling edges of the switch input voltage per power supply system. if only the falling edge is selected, the intb pin not ch anges by the rising edges of switch input voltage. (note 23) if the inz current ?source setti ng? is enabled, the falling edge of the switch input terminal is seen when the extern al switch is turned on. if the inz current ?sink setting? is enabled, the falling edge is seen when the external switch is turned off. table 30. detection edge selection command isb [default: 1] switch edge where interrupt occurs for inb system 0: only falling edge 1: both edges isa [default: 1] switch edge where interrupt occurs for ina system 0: only falling edge 1: both edges isz [default: 1] switch edge where interrupt occurs for inz system 0: only falling edge 1: both edges w/r register write/read setting 0: write 1: read 14. automatic mode transition command this command allows the user to configure the mode to automatically change by a change in switch status. if the automatic transition is enabled, the monitoring period and monitoring method are changed to normal mode settings when it detects a change in switch status on sleep. refer to the ?[basic operation 4] sleep mode operation (automatic tr ansition to normal mode)? section for additional details on how sleep mode operations works for this ic. table 31. automatic mode transition command mr_ier [default: 1] au tomatic mode transition 0: disabled 1: enabled w/r register write/read setting 0: write 1: read 15. monitor mode transition command this command allows the user to change the mode of operation between normal and sleep. refer to the ?[basic operation 3] sl eep mode operation (manual transition)? sect ion for additional details on how sleep mode operations works for this ic. table 32. monitor mode transition command mdc [default: 0] monitoring mode 0: normal mode 1: sleep mode w/r register write/read setting 0: write 1: read xxx crc xxxxxx 9 8 7 to 0 xxxxxxx 15 14 13 12 11 10 setting data crc 23 22 21 20 19 18 17 16 iszxxxxx 1101isbisa detection edge selection isr 0 1 w/r 0 29 28 27 26 25 24 35 34 33 32 31 30 command 0:?l?, 1:?h?, x: don't care register address setting data 39 38 37 36 xxxx crc xxxxxx xxxxxx 12 11 10 9 8 7 to 0 18 17 16 15 14 13 xxx setting data crc 23 22 21 20 19 0 mr_ier xxxx 24 automatic mode transition mir 0 1 w/r 0 1 1 1 30 29 28 27 26 25 36 35 34 33 32 31 command 0:?l?, 1:?h?, x: don't care register address setting data 39 38 37 xxxxx crc xxxxxx 11 10 9 8 7 to 0 xxxxx 17 16 15 14 13 12 23 22 21 20 19 18 xxxx setting data crc 11mdcxxx 25 24 monitor mode trans ition mdr 0 1 w/r 0 1 1 31 30 29 28 27 26 37 36 35 34 33 32 command 0:?l?, 1:?h?, x: don't care register address setting data 39 38
datasheet d a t a s h e e t 36/36 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 command description - continued 16. reset command this command allows the user to reset the registers to thei r initial settings. after the reset command has been sent, the physical interrupt pin goes to low (intb=?l?). table 33. reset command 17. test command this command is used to enter test mode, which is only possible when the test pin is ?h?. table 34. test command 18. register map table 35. register map x x crc xxxxxx 87 to 0 xxxxxxxx 14 13 12 11 10 9 crc 23 22 21 20 19 18 17 16 15 xxxxx setting data 111xxx 26 25 24 reset rst01011 32 31 30 29 28 27 command 0:?l?, 1:?h?, x: don't care register address setting data 39 38 37 36 35 34 33 xxx crc xxxxxx 98 7 to 0 xxxxxxx 15 14 13 12 11 10 setting data crc 23 22 21 20 19 18 17 16 tss5 tss4 tss3 tss2 tss1 tss0 1 0 0 1 tss7 tss6 test tsr 0 1 1 1 29 28 27 26 25 24 35 34 33 32 31 30 command 0:?l?, 1:?h?, x: don't care register address setting data 39 38 37 36 register name symbol register address setting data name (def*: default setting) crc 24 23 22 21 39 to 32 31 30 29 28 27 26 25 20 19 18 17 16 15 14 13 12 11 10 9 8 7 to 0 null command(read only) irc 0x40 crc interrupt notification of switch change setting command [default: valid] ier 0x41 ieb2 (def:1) ieb1 (def:1) ieb0 (def:1) iea2 (def:1) iea1 (def:1) iea0 (def:1) iez3 (def:1) iez2 (def:1) iez1 (def:1) iez0 (def:1) crc comparator operation control command [default: valid] cmr 0x42 cmb2 (def:1) cmb1 (def:1) cmb0 (def:1) cma2 (def:1) cma1 (def:1) cma0 (def:1) cmz3 (def:1) cmz2 (def:1) cmz1 (def:1) cmz0 (def:1) crc comparator threshold selection command [default: 3.0v] ctr 0x43 ctb (def:0) cta (def:0) ctz (def:0) crc inz current source/sink selection command [default: source] pudr 0x44 pud3 (def:0) pud2 (def:0) pud1 (def:0) pud0 (def:0) crc current source activation command [default: off (invalid)] cer 0x45 ceb (def:0) cea (def:0) cez (def:0) crc holding current / wetting current level selection command (lsb) [default: wetting current =1ma (holding current)] lcr 0x46 crh1 (def:0) crh0 (def:0) lcb2 (def:1) lcb1 (def:1) lcb0 (def:1) lca2 (def:1) lca1 (def:1) lca0 (def:1) lcz3 (def:1) lcz2 (def:1) lcz1 (def:1) lcz0 (def:1) crc holding current / wetting current level selection command (msb) [default: wetting current =1ma (holding current)] mcr 0x47 mc b2 (def:0) mc b 1 (def:0) mcb0 (def:0) mc a2 (def:0) mca1 (def:0) mc a0 (def:0) mcz3 (def:0) mc z2 (def:0) mc z1 (def:0) mcz0 (def:0) crc wetting current operation control command [default: invalid] wtr 0x48 wtb2 (def:0) wtb1 (def:0) wtb0 (def:0) wta2 (def:0) wta1 (def:0) wta0 (def:0) wtz3 (def:0) wtz2 (def:0) wtz1 (def:0) wtz0 (def:0) crc n-times matched filter activation control command [default: invalid] dfr 0x49 dfb2 (def:0) dfb1 (def:0) dfb0 (def:0) dfa2 (def:0) dfa1 (def:0) dfa0 (def:0) dfz2 (def:0) dfz1 (def:0) dfz0 (def:0) dfb3 (def:0) dfa3 (def:0) dfz3 (def:0) crc dmux setting command [default: invalid] dmr 0x4a dmx4 (def:0) dmx3 (def:0) dmx2 (def:0) dmx1 (def:0) dmx0 (def:0) crc normal mode setting command [default: full-time monitoring,strobe time:125s, sequential monitoring is invalid] fmr 0x4b fsq (def:0) fsqb (def:0) fsqa (def:0) fsqz (def:0) fitb2 (def:0) fitb1 (def:0) fitb0 (def:0) fita2 (def:0) fita1 (def:0) fita0 (def:0) fitz2 (def:0) fitz1 (def:0) fitz0 (def:0) svw1 (def:0) svw0 (def:1) fitb3 (def:0) fita3 (def:0) fitz3 (def:0) crc sleep mode setting command [default: monitoring period:50ms,sequential monitoring is invalid] smr 0x4c ssq (def:0) ssqb (def:0) ssqa (def:0) ssqz (def:0) sitb2 (def:1) sitb1 (def:1) sitb0 (def:1) sita2 (def:1) sita1 (def:1) sita0 (def:1) sitz2 (def:1) sitz1 (def:1) sitz0 (def:1) sitb3 (def:0) sita3 (def:0) sitz3 (def:0) crc detection edge selection command [default: both edges] isr 0x4d isb (def:1) isa (def:1) isz (def:1) crc automatic mode transition command [default: automatic mode transition is valid] mir 0x4e mr _ ier (def:1) crc monitor mode ttransition command [default: normal mode] mdr 0x4f mdc (def:0) crc reset command rst 0x5f crc interrupt notification of switch change setting command read rier 0x61 crc comparator operation control command read rcmr 0x62 crc comparator threshold selection command read rctr 0x63 crc inz current source/sink selection command read rpudr 0x64 crc current source activation command read rcer 0x65 crc holding current / wetting current level selection command (lsb) read rlcr 0x66 crc holding current / wetting current level selection command (msb) read rmcr 0x67 crc wetting current operation control command read rwtr 0x68 crc n-times matched filter activation control command read rdfr 0x69 crc dmux setting command read rdmr 0x6a crc normal mode setting command read rfmr 0x6b crc sleep mode setting command read rsmr 0x6c crc detection edge selection command read risr 0x6d crc automatic mode transition command read rmir 0x6e crc monitor mode ttransition command read rmdr 0x6f crc test command [default: invalid] tsr 0x79 tss7 (def:0) tss6 (def:0) tss5 (def:0) tss4 (def:0) tss3 (def:0) tss2 (def:0) tss1 (def:0) tss0 (def:0) crc
datasheet d a t a s h e e t 37/37 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 command description - continued table 36. register map (so bit alignment) register name symbol - read data name crc 24 23 22 21 39 to 32 31 30 29 28 27 26 25 20 19 18 17 16 15 14 13 12 11 10 9 8 7 to 0 interrupt notification of switch change setting command read rier ?100?, interrupt factor 00000 ieb2 (def:1) ieb1 (def:1) ieb0 (def:1) 00000 iea2 (def:1) iea1 (def:1) iea0 (def:1) 0000 iez3 (def:1) iez2 (def:1) iez1 (def:1) iez0 (def:1) crc comparator operation control command read rcmr ?100?, interrupt factor 00000 cmb2 (def:1) cmb1 (def:1) cmb0 (def:1) 00000 cma2 (def:1) cma1 (def:1) cma0 (def:1) 0000 cmz3 (def:1) cmz2 (def:1) cmz1 (def:1) cmz0 (def:1) crc comparator threshold selection command read rctr ?100?, interrupt factor ctb (def:0) cta (def:0) ctz (def:0) 000000000000000000000crc inz current source/sink selection command read rpudr ?100?, interrupt factor 00000000000000000000 pud3 (def:0) pud2 (def:0) pud1 (def:0) pud0 (def:0) crc &xuuhqw6rxufh$fwlydwlrq&rppdqg5hdg rcer ?100?, interrupt factor ceb (def:0) cea (def:0) cez (def:0) 000000000000000000000crc holding current / wetting current level selection command (lsb) read rlcr ?100?, interrupt factor crh1 (def:0) crh0 (def:0) 000 lcb2 (def:1) lcb1 (def:1) lcb0 (def:1) 00000 lca2 (def:1) lca1 (def:1) lca0 (def:1) 0000 lcz3 (def:1) lcz2 (def:1) lcz1 (def:1) lcz0 (def:1) crc holding current / wetting current level selection command (msb) read rmcr ?100?, interrupt factor 00000 mc b2 (def:0) mc b1 (def:0) mc b0 (def:0) 00000 mca2 (def:0) mca1 (def:0) mca0 (def:0) 0000 mc z3 (def:0) mc z2 (def:0) mc z1 (def:0) mc z0 (def:0) crc wetting current operation control command read rwtr ?100?, interrupt factor 00000 wtb2 (def:0) wtb1 (def:0) wtb0 (def:0) 00000 wta2 (def:0) wta1 (def:0) wta0 (def:0) 0000 wtz3 (def:0) wtz2 (def:0) wtz1 (def:0) wtz0 (def:0) crc n-times matched filter activation control command read rdfr ?100?, interrupt factor dfb2 (def:0) dfb1 (def:0) dfb0 (def:0) dfa2 (def:0) dfa1 (def:0) dfa0 (def:0) dfz2 (def:0) dfz1 (def:0) dfz0 (def:0) dfb3 (def:0) dfa3 (def:0) dfz3 (def:0) 000000000000crc dmux setting command read rdmr ?100?, interrupt factor dmx4 (def:0) dmx3 (def:0) dmx2 (def:0) dmx1 (def:0) dmx0 (def:0) 0000000000000000000crc normal mode setting command read rfmr ?100?, interrupt factor fsq (def:0) fsqb (def:0) fsqa (def:0) fsqz (def:0) fitb2 (def:0) fitb1 (def:0) fitb0 (def:0) fita2 (def:0) fita1 (def:0) fita0 (def:0) fitz2 (def:0) fitz1 (def:0) fitz0 (def:0) svw1 (def:0) svw0 (def:1) fitb3 (def:0) fita3 (def:0) fitz3 (def:0) 000000crc sleep mode setting command read rsmr ?100?, interrupt factor ssq (def:0) ssqb (def:0) ssqa (def:0) ssqz (def:0) sitb2 (def:1) sitb1 (def:1) sitb0 (def:1) sita2 (def:1) sita1 (def:1) sita0 (def:1) sitz2 (def:1) sitz1 (def:1) sitz0 (def:1) 00 sitb3 (def:0) sita3 (def:0) sitz3 (def:0) 000000crc detection edge selection command read risr ?100?, interrupt factor isb (def:1) isa (def:1) isz (def:1) 000000000000000000000crc automatic mode transition command read rmir ?100?, interrupt factor mr_ ier (def:1) 00000000000000000000000crc monitor mode ttransition command read rmdr ?100?, interrupt factor md c (def:0) 000000000000000 00crc 000000
datasheet d a t a s h e e t 38/38 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 typical performance curves unless otherwise specified, vpua= vpub=13v, vddi=5v, lvdd=avdd=ref5 series products (bd3376muv-m/BD3376EFV-C) use the same data. 0 50 100 150 200 250 300 350 400 450 500 -50 -25 0 25 50 75 100 125 150 vpua/vpub operating current: i vpux(off) [a] ambient temperature : ta[ ? c] vpub=26v vpub=13v vpub=8v figure 23. vpua/vpub operating current vs ambient temperature (continuous monitor setting, current source is invalid, ?hi-z? status) figure 24. vpua/vpub operating current vs supply voltage (continuous monitor setting, current source is invalid, ?hi-z? status) figure 22. por deactivation voltage vs ambient temperature figure 21. por activation voltage vs ambient temperature 3.9 4 4.1 4.2 4.3 4.4 4.5 -50 -25 0 25 50 75 100 125 150 por activation voltage: v por(low) [v] ambient temperature : ta[ ? c] vpub=13v 4 4.1 4.2 4.3 4.4 4.5 4.6 -50-25 0 255075100125150 por deactivation voltage: v por(high) [v] ambient temperature : ta[ ? c] vpub=13v 0 50 100 150 200 250 300 350 400 450 500 5 1015202530 vpua/vpub operating current: ivpux(off) [a] supply voltage : vpub[v] ta=125 ? c ta=25 ? c ta=-40 ? c
datasheet d a t a s h e e t 39/39 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 typical performance curves - continued figure 27. vddi operating current vs ambient temperature (intb=?h?, csb=?h?) figure 28. vddi operating current vs supply voltage (intb=?h?, csb=?h?) figure 25. vpua/vpub average operating current at intermittent monitoring vs ambient temperature (monitoring period: 50ms, strobe time: 125s, source/sink current setting: 1ma) figure 26. vpua/vpub average operating current at intermittent monitoring vs supply voltage (monitoring period: 50ms, strobe time: 125s, source/sink current setting: 1ma) 0 10 20 30 40 50 60 70 80 90 100 -50 -25 0 25 50 75 100 125 150 vpua/vpub average operating current at intermittent monitoring: i vpux(ss) [a] ambient temperature : ta[ ? c] vpub=26v vpub=13v vpub=8v 0 10 20 30 40 50 60 70 80 90 100 5 1015202530 vpua/vpub average operating current at intermittent monitoring: i vpux(ss) [?] supply voltage : vpub[v] ta=125 ? c ta=25 ? c ta=-40 ? c 0 1 2 3 4 5 6 7 8 9 10 -50 -25 0 25 50 75 100 125 150 vddi operating current: i vddi [a] ambient temperature : ta[ ? c] vddi=5.25v vddi=5v vddi=3.1v 0 1 2 3 4 5 6 7 8 9 10 3.0 3.5 4.0 4.5 5.0 5.5 vddi operating current: i vddi [a] supply voltage : vddi[v] ta=125 ? c ta=25 ? c ta=-40 ? c
datasheet d a t a s h e e t 40/40 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 typical performance curves - continued figure 32. source current 1 (1ma setting) vs supply voltage (0v external supply) figure 31. source current 1 (1ma setting) vs ambient temperature (0v external supply) figure 29. ref5 output voltage vs am bient temperature figure 30. ref5 output voltage vs supply voltage 4.75 4.80 4.85 4.90 4.95 5.00 5.05 5.10 5.15 5.20 5.25 -50 -25 0 25 50 75 100 125 150 ref5 output voltage: v ref5 [v] ambient temperature : ta[ ? c] vpub=26v vpub=13v vpub=8v 4.75 4.80 4.85 4.90 4.95 5.00 5.05 5.10 5.15 5.20 5.25 5 1015202530 ref5 output voltage: v ref5 [v] supply voltage : vpub[v] ta=125 ? c ta=25 ? c ta=-40 ? c 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 -50 -25 0 25 50 75 100 125 150 source current 1 (1ma setting): i source1 [ma] ambient temperature : ta[ ? c] vpub=26v vpub=13v vpub=8v 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 0 5 10 15 20 25 30 source current 1 (1ma setting): i source1 [ma] supply voltage : vpub[v] ta=125 ? c ta=-40 ? c ta=25 ? c
datasheet d a t a s h e e t 41/41 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 typical performance curves - continued figure 36. sink current 1 (1ma setting) vs supply voltage (8v external supply) figure 34. source current 1 (1ma setting) vs supply voltage figure 33. source current 1 (1ma setting) vs ambient temperature figure 35.sink current 1 (1ma setting) vs ambient temperature (8v external supply) 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 -50 -25 0 25 50 75 100 125 150 sink current 1 (1ma setting): i sink1 [ma] ambient temperature : ta[ ? c] avdd=5v avdd=4.75 avdd=5.25v 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 4.7 4.8 4.9 5 5.1 5.2 5.3 sink current 1 (1ma setting): i sink1 [ma] supply voltage : avdd[v] ta=125 ? c ta=-40 ? c ta=25 ? c -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 -25 0 25 50 75 100 125 150 source current 1 (1ma setting): i source1 [ma] ambient temperature : ta[ ? c] inz0=4v inz0=8v inz0=0v -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -20-10 0 1020304050 source current 1 (1ma setting): i source1 [ma] supply voltage : inz0[v] ta=25 ? c ta=-40 ? c ta=125 ? c
datasheet d a t a s h e e t 42/42 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 typical performance curves - continued figure 37. sink current 1 (1ma setting) vs ambient temperature figure 38. sink current 1 (1ma setting) vs supply voltage figure 39.source current 2 (3ma setting) vs ambient temperature (0v external supply) figure 40.source current 2 (3ma setting) vs supply voltage (0v external supply) 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 -50 -25 0 25 50 75 100 125 150 source current 2 (3ma setting): i source3 [ma] ambient temperature : ta[ ? c] vpub=8v vpub=13v vpub=26v 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 0 5 10 15 20 25 30 source current 2 (3ma setting): i source3 [ma] supply voltage : vpub[v] ta=125 ? c ta=-40 ? c ta=25 ? c -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 -25 0 25 50 75 100 125 150 sink current 1 (1ma setting): i sink1 [ma] ambient temperature : ta[ ? c] inz0=13v inz0=8v inz0=26v -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -20-10 0 1020304050 sink current 1 (1ma setting): i sink1 [ma] supply voltage : inz0[v] ta=125 ? c ta=-40 ? c ta=25 ? c
datasheet d a t a s h e e t 43/43 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 typical performance curves - continued figure 42. source current 2 (3ma setting) vs supply voltage figure 41. source current 2 (3ma setting) vs ambient temperature figure 43. sink current 2 (3ma setting) vs ambient temperature (8v external supply) figure 44. sink current 2 (3ma setting) vs supply voltage (8v external supply) 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 -50 -25 0 25 50 75 100 125 150 sink current 2 (3ma setting): i sink3 [ma] ambient temperature : ta[ ? c] avdd=4.75v avdd=5v avdd=5.25v 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 4.7 4.8 4.9 5 5.1 5.2 5.3 sink current 2 (3ma setting): i sink3 [ma] supply voltage : avdd[v] ta=125 ? c ta=-40 ? c ta=25 ? c -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 -50 -25 0 25 50 75 100 125 150 source current 2 (3ma setting): i source3 [ma] ambient temperature : ta[ ? c] inz0=0v inz0=8v inz0=4v -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 -20-10 0 1020304050 source current 2 (3ma setting): i source3 [ma] supply voltage : inz0[v] ta=25 ? c ta=-40 ? c ta=125 ? c
datasheet d a t a s h e e t 44/44 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 typical performance curves - continued figure 48. source current 3 (5ma setting) vs supply voltage (0v external supply) figure 47. source current 3 (5ma setting) vs ambient temperature (0v external supply) figure 45. sink current 2 (3ma setting) vs ambient temperature figure 46. sink current 2 (3ma setting) vs supply voltage 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 -50 -25 0 25 50 75 100 125 150 source current 3 (5ma setting): i source5 [ma] ambient temperature : ta[ ? c] vpub=13v vpub=26v vpub=8v 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 0 5 10 15 20 25 30 source current 3 (5ma setting): i source5 [ma] supply voltage : vpub[v] ta=125 ? c ta=-40 ? c ta=25 ? c -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 -50 -25 0 25 50 75 100 125 150 sink current 2 (3ma setting): i sink3 [ma] ambient temperature : ta[ ? c] inz0=13v inz0=8v inz0=26v -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 -20-10 0 1020304050 sink current 2 (3ma setting): i sink3 [ma] supply voltage : inz0[v] ta=125 ? c ta=-40 ? c ta=25 ? c
datasheet d a t a s h e e t 45/45 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 typical performance curves - continued figure 52. sink current 3 (5ma setting) vs supply voltage (8v external supply) figure 50. source current 3 (5ma setting) vs supply voltage figure 51. sink current 3 (5ma setting) vs ambient temperature (8v external supply) figure 49. source current 3 (5ma setting) vs ambient temperature 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 -50 -25 0 25 50 75 100 125 150 sink current 3 (5ma setting): i sink5 [ma] ambient temperature : ta[ ? c] avdd=5v avdd=5.25v avdd=4.75v 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 4.7 4.8 4.9 5 5.1 5.2 5.3 sink current 3 (5ma setting): i sink5 [ma] supply voltage : avdd[v] ta=125 ? c ta=-40 ? c ta=25 ? c -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 -50 -25 0 25 50 75 100 125 150 source current 3 (5ma setting): i source5 [ma] ambient temperature : ta[ ? c] inz0=4v inz0=0v inz0=8v -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 -20-10 0 1020304050 source current 3 (5ma setting): i source5 [ma] supply voltage : inz0[v] ta=25 ? c ta=-40 ? c ta=125 ? c
datasheet d a t a s h e e t 46/46 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 typical performance curves - continued figure 54. sink current 3 (5ma setting) vs supply voltage figure 53. sink current 3 (5ma setting) vs ambient temperature figure 56. source current 4 (10ma setting) vs supply voltage (0v external supply) figure 55. source current 4 (10ma setting) vs ambient temperature (0v external supply) 10 11 12 13 14 15 16 17 18 -50 -25 0 25 50 75 100 125 150 source current 4 (10ma setting): i source10 [ma] ambient temperature : ta[ ? c] vpub=8v vpub=26v vpub=13v 10 11 12 13 14 15 16 17 18 0 5 10 15 20 25 30 source current 4 (10ma setting): i source10 [ma] supply voltage : vpub[v] ta=25 ? c ta=-40 ? c ta=125 ? c -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 -50 -25 0 25 50 75 100 125 150 sink current 3 (5ma setting): i sink5 [ma] ambient temperature : ta[ ? c] inz0=13v inz0=8v inz0=26v -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 -20-10 0 1020304050 sink current 3 (5ma setting): i sink5 [ma] supply voltage : inz0[v] ta=125 ? c ta=-40 ? c ta=25 ? c
datasheet d a t a s h e e t 47/47 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 typical performance curves - continued figure 58. source current 4 (10ma setting) vs supply voltage figure 57.source current 4 (10ma setting) vs ambient temperature figure 59. sink current 4 (10ma setting) vs ambient temperature (8v external supply) figure 60. sink current 4 (10ma setting) vs supply voltage (8v external supply) 10 11 12 13 14 15 16 17 18 -50-25 0 255075100125150 sink current 4 (10ma setting): i sink10 [ma] ambient temperature : ta[ ? c] avdd=5v avdd=4.75v avdd=5.25v 10 11 12 13 14 15 16 17 18 4.7 4.8 4.9 5 5.1 5.2 5.3 sink current 4 (10ma setting): i sink10 [ma] supply voltage : avdd[v] ta=25 ? c ta=-40 ? c ta=125 ? c -2 0 2 4 6 8 10 12 14 16 18 20 -50 -25 0 25 50 75 100 125 150 source current 4 (10ma setting): i source10 [ma] ambient temperature : ta[ ? c] inz0=0v inz0=8v inz0 =4v -2 0 2 4 6 8 10 12 14 16 18 20 -20-10 0 1020304050 source current 4 (10ma setting): i source10 [ma] supply voltage : inz0[v] ta=25 ? c ta=-40 ? c ta=125 ? c
datasheet d a t a s h e e t 48/48 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 typical performance curves - continued figure 61. sink current 4 (10ma setting) vs ambient temperature figure 62. sink current 4 (10ma setting) vs supply voltage figure 64. source current 5 (15ma setting) vs supply voltage (0v external supply) figure 63. source current 5 (15ma setting) vs ambient temperature (0v external supply) 15 17 19 21 23 25 27 -50 -25 0 25 50 75 100 125 150 source current 5 (15ma setting): i source15 [ma] ambient temperature : ta[ ? c] vpub=26v vpub=13v vpub=8v 15 17 19 21 23 25 27 0 5 10 15 20 25 30 source current 5 (15ma setting): i source15 [ma] supply voltage : vpub[v] ta=25 ? c ta=-40 ? c ta=125 ? c -2 0 2 4 6 8 10 12 14 16 18 20 -50 -25 0 25 50 75 100 125 150 sink current 4 (10ma setting): i sink10 [ma] ambient temperature : ta[ ? c] inz0=8v inz0=26v inz0=13v -2 0 2 4 6 8 10 12 14 16 18 20 -20-10 0 1020304050 sink current 4 (10ma setting): i sink10 [ma] supply voltage : inz0[v] ta=25 ? c ta=-40 ? c ta=125 ? c
datasheet d a t a s h e e t 49/49 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 typical performance curves - continued figure 65. source current 5 (15ma setting) vs ambient temperature figure 66. source current 5 (15ma setting) vs supply voltage figure 67. sink current 5 (15ma setting) vs ambient temperature (8v external supply) figure 68. sink current 5 (15ma setting) vs supply voltage (8v external supply) 15 17 19 21 23 25 27 -50 -25 0 25 50 75 100 125 150 sink current 5 (15ma setting): i sink15 [ma] ambient temperature : ta[ ? c] avdd=5.25v avdd=5v avdd=4.75v 15 17 19 21 23 25 27 4.7 4.8 4.9 5 5.1 5.2 5.3 sink current 5 (15ma setting): i sink15 [ma] supply voltage : avdd[v] ta=125 ? c ta=25 ? c ta=-40 ? c -5 0 5 10 15 20 25 30 -50 -25 0 25 50 75 100 125 150 source current 5 (15ma setting): i source15 [ma] ambient temperature : ta[ ? c] inz0=0v inz0=8v inz0=4v -5 0 5 10 15 20 25 30 -20-10 0 1020304050 source current 5 (15ma setting): i source15 [ma] supply voltage : inz0[v] ta=25 ? c ta=-40 ? c ta=125 ? c
datasheet d a t a s h e e t 50/50 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 typical performance curves - continued figure 69. sink current 5 (15ma setting) vs ambient temperature figure 70. sink current 5 (15ma setting) vs supply voltage figure 72. low to high switch detection threshold voltage (3.0v setting) vs supply voltage figure 71. low to high switch detection threshold voltage (3.0v setting) vs ambient temperature 2.7 2.8 2.9 3.0 3.1 3.2 3.3 -50 -25 0 25 50 75 100 125 150 low to high switch detection threshold voltage (3.0v setting): v th3(high) [v] ambient temperature : ta[ ? c] vpub=26v vpub=8v vpub=13v 2.7 2.8 2.9 3.0 3.1 3.2 3.3 5 1015202530 low to high switch detection threshold voltage (3.0v setting): v th3(high) [v] supply voltage : vpub[v] ta=25 ? c ta=-40 ? c ta=125 ? c -5 0 5 10 15 20 25 30 -50-25 0 255075100125150 sink current 5 (15ma setting): i sink15 [ma] ambient temperature : ta[ ? c] inz0= 26v inz0=13v inz0=8v -5 0 5 10 15 20 25 30 -20-10 0 1020304050 sink current 5 (15ma setting): i sink15 [ma] supply voltage : inz0[v] ta=25 ? c ta=-40 ? c ta=125 ? c
datasheet d a t a s h e e t 51/51 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 typical performance curves - continued figure 73. high to low switch detection threshold voltage (3.0v setting) vs ambient temperature figure 74. high to low switch detection threshold voltage (3.0v setting) vs supply voltage figure 76. low to high switch detection threshold voltage (4.0v setting) vs supply voltage figure 75. low to high switch detection threshold voltage (4.0v setting) vs ambient temperature 2.6 2.7 2.8 2.9 3.0 3.1 3.2 -50 -25 0 25 50 75 100 125 150 high to low switch detection threshold voltage (3.0v setting): v th3(low) [v] ambient temperature : ta[ ? c] vpub=26v vpub=8v vpub=13v 2.6 2.7 2.8 2.9 3.0 3.1 3.2 5 1015202530 high to low switch detection threshold voltage (3.0v setting): v th3(low) [v] supply voltage : vpub[v] ta=25 ? c ta=-40 ? c ta=125 ? c 3.7 3.8 3.9 4.0 4.1 4.2 4.3 -50 -25 0 25 50 75 100 125 150 low to high switch detection threshold voltage (4.0v setting): v th4(high) [v] ambient temperature : ta[ ? c] vpub=26v vpub=8v vpub=13v 3.7 3.8 3.9 4.0 4.1 4.2 4.3 5 1015202530 low to high switch detection threshold voltage (4.0v setting): v th4(high) [v] supply voltage : vpub[v] ta=25 ? c ta=-40 ? c ta=125 ? c
datasheet d a t a s h e e t 52/52 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 typical performance curves - continued figure 77. high to low switch detection threshold voltage (4.0v setting) vs ambient temperature figure 78. high to low switch detection threshold voltage (4.0v setting) vs supply voltage figure 79. serial interface threshold voltage vs ambient temperature figure 80. serial interface threshold voltage vs supply voltage 3.6 3.7 3.8 3.9 4.0 4.1 4.2 -50-25 0 255075100125150 high to low switch detection threshold voltage (4.0v setting): v th4(hlow) [v] ambient temperature : ta[ ? c] vpub=26v vpub=8v vpub=13v 3.6 3.7 3.8 3.9 4.0 4.1 4.2 5 1015202530 high to low switch detection threshold voltage (4.0v setting): v th4(low) [v] supply voltage : vpub[v] ta=25 ? c ta=-40 ? c ta=125 ? c
datasheet d a t a s h e e t 53/53 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 typical performance curves - continued figure 81. csb input current vs ambient temperature (csb=vddi) figure 82. csb input current vs supply voltage (csb=vddi) figure 84. csb pull-up current vs supply voltage (csb=0v) figure 83.csb pull-up current vs ambient temperature (csb=0v) -10 -8 -6 -4 -2 0 2 4 6 8 10 -50 -25 0 25 50 75 100 125 150 csb input current: i cs(high) [a] ambient temperature : ta[ ? c] vddi=3.1v vddi=5v vddi=5.25v -10 -8 -6 -4 -2 0 2 4 6 8 10 3.0 3.5 4.0 4.5 5.0 5.5 csb input current: i cs(high) [?] supply voltage : vddi[v] ta=-40 ? c ta=25 ? c ta=125 ? c 30 35 40 45 50 55 60 65 70 75 80 85 -50 -25 0 25 50 75 100 125 150 csb pull-up current: i cs(low) [a] ambient temperature : ta[ ? c] vddi=3.1v vddi=5v vddi=5.25v 30 35 40 45 50 55 60 65 70 75 80 85 3.0 3.5 4.0 4.5 5.0 5.5 csb pull-up current: i cs(low) [?] supply voltage : vddi[v] ta=125 ? c ta=-40 ? c ta=25 ? c
datasheet d a t a s h e e t 54/54 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 typical performance curves - continued figure 85. si, sclk pull-down resistor vs ambient temperature figure 86. si, sclk pull-down resistor vs supply voltage figure 87. si, sclk input current vs ambient temperature (si, sclk=0v) figure 88. si, sclk input current vs supply voltage (si, sclk=0v) 50 60 70 80 90 100 110 120 130 140 150 -50 -25 0 25 50 75 100 125 150 si, sclk pull-down resistor: r si , r sclk [k ? ? c] vddi=3.1v vddi=5v vddi=5.25v 50 60 70 80 90 100 110 120 130 140 150 3.03.54.04.55.05.5 si, sclk pull-down resistor: r si , r sclk [k ? ? c ta=-40 ? c ta=125 ? c -10 -8 -6 -4 -2 0 2 4 6 8 10 -50-25 0 255075100125150 si, sclk input current: i si(low), i sclk(low) [?] ambient temperature : ta[ ? c] vddi=3.1v vddi=5v vddi=5.25v -10 -8 -6 -4 -2 0 2 4 6 8 10 3.0 3.5 4.0 4.5 5.0 5.5 si, sclk input current: i si(low), i sclk(low) [a] supply voltage : vddi[v] ta=125 ? c ta=25 ? c ta=-40 ? c
datasheet d a t a s h e e t 55/55 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 typical performance curves - continued figure 89. so ?h? level output voltge vs ambient temperature (i source =200a) figure 90. so ?h? level output voltage vs supply voltage (i source =200a) figure 92. so ?l? level output voltage vs supply voltage (i sink =1.6ma) figure 91. so ?l? level output voltage vs ambient temperature (i sink =1.6ma) 0 1 2 3 4 5 6 7 -50 -25 0 25 50 75 100 125 150 so ?h? level output voltge: v so(high) [v] ambient temperature : ta[ ? c] vddi=3.1v vddi=5v vddi=5.25v 0 1 2 3 4 5 6 7 3.0 3.5 4.0 4.5 5.0 5.5 so ?h? level output voltage: v so(high) [v] supply voltage : vddi[v] ta=125 ? c ta=-40 ? c ta=25 ? c 0 50 100 150 200 250 300 350 400 -50 -25 0 25 50 75 100 125 150 so ?l? level output voltage: v so(low) [mv] ambient temperature : ta[ ? c] vddi=5v vddi=5.25v vddi=3.1v 0 50 100 150 200 250 300 350 400 3.03.54.04.55.05.5 so ?l? level output voltage: v so(low) [mv] supply voltage : vddi[v] ta=-40 ? c ta=125 ? c ta=25 ? c
datasheet d a t a s h e e t 56/56 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 typical performance curves - continued figure 95. dmux ?h? level output voltage vs ambient temperature (i source =200a) figure 96. dmux ?h? level output voltage vs supply voltage (i source =200a) figure 93. so (set to ?hi-z?) input current vs ambient temperature figure 94. so (set to ?hi-z?) input current vs supply voltage -10 -8 -6 -4 -2 0 2 4 6 8 10 -50 -25 0 25 50 75 100 125 150 so (set to ?hi-z?) input current: i so(tri) [ma] ambient temperature : ta[ ? c] vddi=3.1v vddi=5v vddi=5.25v -10 -8 -6 -4 -2 0 2 4 6 8 10 3.0 3.5 4.0 4.5 5.0 5.5 so (set to ?hi-z?) input current: i so(tri) [ma] supply voltage : vddi[v] ta=125 ? c ta=25 ? c ta=-40 ? c 0 1 2 3 4 5 6 7 -50-25 0 255075100125150 dmux ?h? level output voltage: v dmux(high) [v] ambient temperature : ta[ ? c] vddi=5v vddi=5.25v vddi=3.1v 0 1 2 3 4 5 6 7 3.0 3.5 4.0 4.5 5.0 5.5 dmux ?h? level output voltage: v dmux(high) [v] supply voltage : vddi[v] ta=25 ? c ta=-40 ? c ta=125 ? c
datasheet d a t a s h e e t 57/57 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 typical performance curves - continued figure 97. dmux ?l? level output voltage vs ambient temperature (i sink =1.6ma) figure 98. dmux ?l? level output voltage vs supply voltage (i sink =1.6ma) figure 100. intb internal pull-up current vs supply voltage figure 99. intb internal pull-up current vs ambient temperature 0 50 100 150 200 250 300 350 400 -50 -25 0 25 50 75 100 125 150 dmux ?l? level output voltage: v dmux(low) [mv] ambient temperature : ta[ ? c] vddi=5v vddi=5.25v vddi=3.1v 0 50 100 150 200 250 300 350 400 3.0 3.5 4.0 4.5 5.0 5.5 dmux ?l? level output voltage: v dmux(low) [mv] supply voltage : vddi[v] ta=25 ? c ta=-40 ? c ta=125 ? c 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 -50 -25 0 25 50 75 100 125 150 intb internal pull-up current: i intb(pu) [a] ambient temperature : ta[ ? c] vddi=5v vddi=5.25v vddi=3.1v 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 3.0 3.5 4.0 4.5 5.0 5.5 intb internal pull-up current: i intb(pu) [?] supply voltage : vddi[v] ta=125 ? c ta=-40 ? c ta=25 ? c
datasheet d a t a s h e e t 58/58 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 typical performance curves - continued figure 101. intb ?h? level output voltage vs ambient temperature (intb=open) figure 102. intb ?h? level output voltage vs supply voltage (intb=open) figure 104. intb ?l? level output voltage vs supply voltage (i sink =1.0ma) figure 103. intb ?l? level output voltage vs ambient temperature (i sink =1.0ma) 0 1 2 3 4 5 6 7 -50 -25 0 25 50 75 100 125 150 intb ?h? level output voltage: v intb(high) [v] ambient temperature : ta[ ? c] vddi=5v vddi=5.25v vddi=3.1v 0 1 2 3 4 5 6 7 3.0 3.5 4.0 4.5 5.0 5.5 intb ?h? level output voltage: v intb(high) [v] supply voltage : vddi[v] ta=125 ? c ta=-40 ? c ta=25 ? c 0 50 100 150 200 250 300 350 400 -50 -25 0 25 50 75 100 125 150 intb ?l? level output voltage: v intb(low) [mv] ambient temperature : ta[ ? c] avdd=5v avdd=5.25v avdd=4.75v 0 50 100 150 200 250 300 350 400 4.7 4.8 4.9 5.0 5.1 5.2 5.3 intb ?l? level output voltage: v intb(low) [mv] supply voltage : avdd[v] ta=125 ? c ta=-40 ? c ta=25 ? c
datasheet d a t a s h e e t 59/59 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 typical performance curves - continued figure 106. wakeb ?l? level output voltage vs supply voltage (wakeb=1.0ma) figure 105. wakeb ?l? level output voltage vs ambient temperature (wakeb=1.0ma) figure 107. wakeb (set to ?hi-z?) input current vs ambient temperature figure 108. wakeb (set to ?hi-z?) input current vs supply voltage 0 50 100 150 200 250 300 350 400 -50-25 0 255075100125150 wakeb ?l? level output voltage: v wakeb(low) [mv] ambient temperature : ta[ ? c] avdd=5v avdd=5.25v avdd=4.75v 0 50 100 150 200 250 300 350 400 4.74.84.95.05.15.25.3 wakeb ?l? level output voltage: v wakeb(low) [mv] supply voltage : avdd[v] ta=125 ? c ta=-40 ? c ta=25 ? c -10 -8 -6 -4 -2 0 2 4 6 8 10 -50 -25 0 25 50 75 100 125 150 wakeb (set to ?hi-z?) input current: i wakeb(tri) [?] ambient temperature : ta[ ? c] vpub=8v vpub=13v vpub=26v -10 -8 -6 -4 -2 0 2 4 6 8 10 5.0 10.0 15.0 20.0 25.0 30.0 wakeb (set to ?hi-z?) input current: i wakeb(tri) [a] supply voltage : vpub[v] ta=125 ? c ta=25 ? c ta=-40 ? c
datasheet d a t a s h e e t 60/60 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 typical performance curves - continued 80 85 90 95 100 105 110 4.7 4.8 4.9 5.0 5.1 5.2 5.3 switch strobe time(93.75s setting): t scan_94 [s] supply voltage : lvdd/avdd[v] ta=125 ? c ta=-40 ? c ta=25 ? c 80 85 90 95 100 105 110 -50 -25 0 25 50 75 100 125 150 switch strobe time(93.75? setting): t scan_94 [s] ambient temperature : ta[c] lvdd/avdd=5.25v lvdd/avdd=5v lvdd/avdd=4.75v figure 110. switch strobe time(93.75? setting) vs supply voltage figure 109. switch strobe time(93.75? setting) vs ambient temperature figure 111. switch strobe time(125? setting) vs ambient temperature figure 112. switch strobe time(125? setting) vs supply voltage 110 115 120 125 130 135 140 -50 -25 0 25 50 75 100 125 150 switch strobe time(125s setting): t scan_125 [?] ambient temperature : ta[c] lvdd/avdd=5.25v lvdd/avdd=5v lvdd/avdd=4.75v 110 115 120 125 130 135 140 4.7 4.8 4.9 5.0 5.1 5.2 5.3 switch strobe time(125s setting): t scan_125 [s] supply voltage : lvdd/avdd[v] ta=125 ? c ta=-40 ? c ta=25 ? c
datasheet d a t a s h e e t 61/61 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 typical performance curves - continued figure 114. switch strobe time(187.5s setting) vs supply voltage figure 113. switch strobe time(187.5s setting) vs ambient temperature figure 116. switch strobe time(250s setting) vs supply voltage figure 115. switch strobe time(250s setting) vs ambient temperature 160 165 170 175 180 185 190 195 200 205 210 -50 -25 0 25 50 75 100 125 150 switch strobe time(187.5s setting): t scan_188 [s] ambient temperature : ta[c] lvdd/avdd=5.25v lvdd/avdd=5v lvdd/avdd=4.75v 160 165 170 175 180 185 190 195 200 205 210 4.7 4.8 4.9 5.0 5.1 5.2 5.3 switch strobe time(187.5s setting): t scan_188 [s] supply voltage : lvdd/avdd[v] ta=125 ? c ta=-40 ? c ta=25 ? c 220 225 230 235 240 245 250 255 260 265 270 275 280 -50 -25 0 25 50 75 100 125 150 switch strobe time(250? setting): t scan_250 [s] ambient temperature : ta[c] lvdd/avdd=5.25v lvdd/avdd=5v lvdd/avdd=4.75v 220 225 230 235 240 245 250 255 260 265 270 275 280 4.7 4.8 4.9 5.0 5.1 5.2 5.3 switch strobe time(250s setting): t scan_250 [s] supply voltage : lvdd/avdd[v] ta=125 ? c ta=-40 ? c ta=25 ? c
datasheet d a t a s h e e t 62/62 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 typical performance curves - continued 0 5 10 15 20 25 30 35 40 45 50 -50 -25 0 25 50 75 100 125 150 source/sink current fall time: t sr_f [s] ambient temperature : ta[c] vpub=13v vpub=26v vpub=8v 0 5 10 15 20 25 30 35 40 45 50 -50 -25 0 25 50 75 100 125 150 source/sink current rise time: t sr_r [s] ambient temperature : ta[c] vpub=13v vpub=26v vpub=8v figure 118. source/sink current rise time vs supply voltage (fsq=?0?, fsqz/a/b=?0?, 10ma setting, load resistance=100 ? ? ? ? ? c ta=-40 ? c ta=25 ? c 0 5 10 15 20 25 30 35 40 45 50 5.0 10.0 15.0 20.0 25.0 30.0 source/sink current fall time: t sr_f [?] supply voltage : vpub[v] ta=125 ? c ta=-40 ? c ta=25 ? c
datasheet d a t a s h e e t 63/63 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 application circuit examples 1. example of application circuit and its external components figure 121. example of application circuit and its external components capacitor (c11, c12, c14) at power supply pins (vpua, vpub, vddi) insert a 0.1f capacitor between each power supply pin (vpu a, vpub, and vddi) and ground. make sure to design the external components with sufficient margin for the intended appl ication. it is recommended to use capacitors with excellent voltage and temperature characteristics. capacitor (c10) at ref5 in order to prevent oscillation, a capacitor needs to be pl aced between the ref5 output pin and ground. it is recommended to use a capacitor (electrolytic, tantalum, or ceramic of at least 4.7f). make sure that capacitance of 4.7f or higher is maintained at the intended operating supply voltage and temp erature range. temperature c hange can cause fluctuation in capacitance, which may lead to oscillation. if a ceramic capaci tor is chosen, it is recommended to use x5r, x7r, or any others with better temperature and dc biasing char acteristics and higher voltage tolerance. capacitor(c0 to c9) at switch pin (inz, ina, inb) it is recommended to use at least 0.1f capacitors as protection against esd. make sure to desi gn the external circuit with sufficient margin for the intended application. use capa citors with application specific voltage and temperature characteristics. resistor (r0 to r9) at switch pin (inz, ina, inb) choose the appropriate resistor to reduce emi noise. design the circuit so the pin voltage does not fall below the threshold voltage defined by ground float of [load resistance] x [wetting current] (when wetting current is set to source) or voltage drop (when wetting current is set to sink) may occur.
datasheet d a t a s h e e t 64/64 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 application circuit examples - continued 2. example of parallel connection circuit figure 122. example of parallel connection circuit parallel connection please prepare csb terminals respectively.
datasheet d a t a s h e e t 65/65 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 i / o equivalence circuit type equivalence circuit type equivalence circuit a input: si, sclk (with an internal pull-down resistor) b input: csb (with an internal pull-up current source) c open-drain interrupt output: intb (with an internal pull-up resistor) d open-drain output: wakeb e switch input: inz0 to inz3 (with an internal pull-up/down current source) f switch input: ina0 to ina2, inb0 to inb2 (with an internal pull-up current source) g output: dmux h output: so vddi vddi
datasheet d a t a s h e e t 66/66 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 i / o equivalence circuit- continued type equivalence circuit type equivalence circuit i output: ref5 j input: test (with an internal pull-down resistor)
datasheet d a t a s h e e t 67/67 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance s upply lines. separate the gro und and supply lines of the digital and analog blocks to prev ent noise in the ground and supp ly lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. cons ider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces shou ld be routed separately but connected to a single ground at the refer ence point of the application board to av oid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external component s do not cause variations on the ground voltage. the ground lines must be as s hort and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the maximum junction temperature ra ting be exceeded the rise in te mperature of the chip may result in deterioration of the properti es of the chip. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceedin g the maximum junction temperature rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guarante ed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power c oupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comp letely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage fr om static discharge, ground the ic during as sembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnec ted, the electric field from the out side can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused in put pins should be connected to the power supply or ground line.
datasheet d a t a s h e e t 68/68 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 operational notes ? continued 12. regarding the input pin of the ic this monolithic ic contains p+ isolat ion and p substrate layers between adj acent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n j unction operates as a parasitic diode. when gnd > pin b, the p-n junction o perates as a parasitic transistor. parasitic diodes inevitably occur in t he structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 123. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine a capacitanc e value considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevents heat damage to t he ic. normal operation should always be within the ic?s maximum junction temperature rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the ts d circuit that will turn off a ll output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceed s the absolute maximum rati ngs and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other t han protecting the ic from heat damage.
datasheet d a t a s h e e t 69/69 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 ordering information b d 3 3 7 6 e f v - ce 2 part number package efv: htssop-b30 rank c:automotive packaging and forming specification e2:embossed tape and reel figure 124. ordering information marking diagram figure 125. marking diagram htssop-b30 (top view) bd3376 part number marking lot numbe r 1pin mark
datasheet d a t a s h e e t 70/70 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 physical dimension, tape and reel information package name htssop-b30 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape (with dry pack) tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin
datasheet d a t a s h e e t 71/71 tsz22111 ? 15 ? 001 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com 25.apr.2017 rev.002 BD3376EFV-C tsz02201-0e3e0hz00740-1-2 revision history date rev. history 02.sep.2016 001 (japanese only) 25.apr.2017 002 new release
notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. ( n ote1) m edical equipment classifica tion of the specific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a cert ain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the f ollowing are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any specia l or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, prior to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our products in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cle aning residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proof design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation o f performance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under de viant condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products, please consult with th e rohm representative in advance. for details , please refer to rohm mounting specification
notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin con sidering variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contain ed in this document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contain ed in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive pr oduct, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condi tion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connecti ons may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are e xposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaut ion for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all informa tion and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third pa rty regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or impli ed, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert its intellectual property rig hts or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the pr oducts may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated com panies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number BD3376EFV-C package htssop-b30 unit quantity 2000 minimum package quantity 2000 packing type taping constitution materials list inquiry rohs yes BD3376EFV-C - web page distribution inventory

▲Up To Search▲

Price & Availability of BD3376EFV-C

	To Download BD3376EFV-C Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .